XPG LANCER BLADE DDR5 6000 MT/s CL28 Memory Unboxing Review

AVerMedia has recently launched the tight-timing XPG LANCER BLADE DDR5 6000 MT/s CL28 2x 16GB memory, with Intel XMP 3.0 and AMD EXPO overclocking profile of CL 28-36-36-96 1.4V written in the SPD HUB, which is a more cost-effective low-timing option in the market today. For your reference, we have conducted a performance test with the 9950X3D.

XPG LANCER BLADE DDR5 6000 MT/s 16GB x2 CL28 memory specification:

QVL Enquiry: Black AX5U6000C2816G-DTLABBK / White AX5U6000C2816G-DTLABWH
Capacity: 32GB (2x16GB)
Speed: DDR5 6000 MT/s
Chronology: CL 28-36-36-96
Voltage: 1.4V
Specification: 288-Pin DDR5 UDIMM
Warranty: Lifetime Warranty
Dimensions: 133.3 mm x 7.8 mm x 33.8 mm (length x thickness x height)
Profile parameters: Intel XMP 3.0 certification (Extreme Memory Profile), AMD EXPO certification (Extended Profiles for Overclocking)

Low Timing Low Height XPG LANCER BLADE DDR5 6000 MT/s CL28 Memory Unboxing

I unboxed it last year. XPG LANCER BLADE DDR5 6400 MT/s CL32-39-39-89 1.4V MemoryThis time, the unboxing is a new specification with the same heatsink model, with a frequency of 6000 MT/s and a timing of CL 28-36-36-96 1.4V.

The QVL serial number is AX5U6000C2816G-DTLABBK in black and AX5U6000C2816G-DTLABWH in white. The SPD also has Intel XMP 3.0 (Extreme Memory Profile) and AMD EXPO (Extended Profiles for Overclocking) overclocking profiles written on it, so it is compatible with Intel 12th / 13th / 14th / Core Ultra 200 series platforms and AMD Ryzen 9000 / 8000 / 7000 series platforms. The SPD is also written with Intel XMP 3.0 (Extreme Memory Profile) and AMD EXPO (EXtended Profiles for Overclocking) overclocking profiles, making it compatible with Intel 12th / 13th / 14th / Core Ultra 200 series platforms, as well as AMD Ryzen 9000 / 8000 / 7000 series platforms.

Since it uses the same heatsink, I won't go into the exterior styling part of this article, so if you're interested, you can just refer to the previous unboxing article.

∆ XPG LANCER BLADE DDR5 6000 MT/s CL28 memory with built-in write to XMP and EXPO.

The ∆ timing is CL 28-36-36-96 1.4V.

The ∆ memory height is 33.8 mm.

∆ XPG LANCER BLADE DDR5 has no light bar on the top but only the XPG logo.

 

The unboxed XPG LANCER BLADE DDR5 with overclocking profile enabled is a DDR5-6000 MT/s CL 28-36-36-96 1.4V 32GB (16GB x2) with SS (Single Sided) cell and 1R (1 Rank) layout, and a single DRAM. The IC Count specification consists of eight 2 GB (2048 MB) DRAM cells.

∆ SS (Single Sided) Single Sided particles, 1R (1 Rank), eight 2 GB (2048 MB) particles.

The ∆ side view of the SPD HUB and PMIC area is not equipped with thermal pads to help dissipate the heat, but the temperature should be fine for this specification, and I will test it later to see how it looks like.

 

AMD Ryzen 9 9950X3D and X870E Platform Memory Performance Tests

Using the AMD Ryzen 9000 platform with DDR5 memory support, see how this memory performs on the AMD platform, using the AMD Ryzen 9 9950X3D processor and the X870E motherboard to test the performance of DDR5 memory.

Testing Platform

Processor: AMD Ryzen 9 9950X3D
Cooler: ASUS Ryuo IV SLC 360 ARGB (Full Speed)
Motherboard: CROSSHAIR X870E EXTREME ( BIOS Version: 1504 )
Memory: XPG LANCER BLADE DDR5 6000 MT/s 2x 16 GB CL 28-36-36-96 1.4V
Graphics: ASUS Prime Radeon RX 9060 XT 16GB GDDR6 OC
Operating System: Windows 11 Professional 24H2
Graphics driver: AMD 25.10.09.01

 

In the motherboard's BIOS, there are two XMP and EXPO profiles built into the memory, and the only overclocking profile available is DDR5-6000 CL 28-36-36-96 1.4V, and from the SPD information, you can see that the DRAM ICs use Hynix chips.

∆ Hynix particles and Richtek's PMIC.

∆ The built-in Profile profile.

 

由 CPU-Z Looking at the AMD Ryzen 9 9950X3D and X870E test platforms, the SPD page shows that the XPG LANCER BLADE DDR5 6000 MT/s CL28 2x 16GB memory uses SK Hynix cells and supports Intel XMP 3.0 (Extreme Memory Profile), AMD EXPO (EXtended Profiles for Overclocking) one-click overclocking profile.

∆ AMD platform CPU-Z.

 

utilization AIDA64 Cache & Memory Benchmark XPG LANCER BLADE DDR5 6000 MT/s CL28 2x 16GB memory was tested at 57 GB/s read, 61.8 GB/s write, 54.7 GB/s copy, and 94.7 ns latency at 4800 MT/s JEDEC.

With EXPO Profile 1's DDR5-6000 CL 28-36-36-96 1.4V turned on, read speeds were 76.2 GB/s, write speeds were 76.5 GB/s, copy speeds were 66.2 GB/s, and latency was 78.5 ns.

∆ Default JEDEC Frequency: DDR5-4800 CL 40-39-39-77 1.1V_AMD Platform Test Results.

∆ EXPO Profile 1: DDR5-6000 CL 28-36-36-96 1.4V_AMD Platform Test Results.

 

The game was tested using the FF14 Golden Legacy_FINAL FANTASY XIV: Dawntrail Official Benchmark released in 2024, with the texture quality set to "Highest Quality" and AMD FSR enabled.

∆ Default JEDEC Frequency: DDR5-4800 CL 40-39-39-77 1.1V_AMD Platform Test Results.

∆ EXPO Profile 1: DDR5-6000 CL 28-36-36-96 1.4V_AMD Platform Test Results.

 

Memory Thermal Performance Test

And then through OCCT MEMORY CONFIGURATION To test the pressure stability of the memory, the memory load of the manual setting software is 99%, the memory test setting is memory EXPO Profile 1 parameter DDR5-6000 28-36-36-96 1.4V, and the test scene is a closed air-conditioned room with an indoor temperature of 24 °C for the actual test, while the data is collected by using HWiNFO64 to collect and record the temperature of the SPD Hub after one hour of testing. Data was collected using the HWiNFO64 to collect and record the temperature of the SPD Hub after one hour of testing, with a maximum temperature of 64.8 °C. The SPD Hub temperature was recorded as the maximum temperature of the SPD Hub.

We would like to remind you that the test platform is placed on an open chassis platform and there is no additional fan to help dissipate the heat from the memory, so the temperature test is for reference only.

∆ Fanless for OCCT MEMORY CONFIGURATION Temperature Stress Test, SPD Hub up to 64.8 °C.

 

Conclusion

Currently, the market considers DDR5 6000 MT/s to be a low latency specification starting from CL 28 or CL 26 below CL 30. Compared to the high frequency of 8000 MT/s, people tend to choose 6000 MT/s CL 28 or 6400 MT/s CL 32, etc., which is a cheaper specification to install in terms of cost-effectiveness and practicability. The cheaper specification is the one to be installed.

With the enhanced platform performance and firmware optimization such as BIOS, DDR5 6000 MT/s can gradually go down to the CL 28 value. Excluding Chinese brands that sell this specification, there is only Chips Ahoy in Taiwan except for AVerMedia, and AVerMedia's advantage under the same timing specification is that it is cheaper, the LANCER RGB version is cheaper by $800; and LANCER BLADE DDR5 is cheaper by about $1,200 (just refer to the list of models available in the price increase house for comparison). Today's LANCER BLADE DDR5 is cheaper by about $1,200 (just refer to the list of models available in the price hut for comparison), why do you exclude the Chinese brands? Because there is no warranty for buying over seas, and the budget for QVL certified samples of Chinese brands is basically not as much as that of Taiwan factories, and then again, I basically don't consider Chinese brands at all when choosing my own memory brands.

Overclocked from 4800 MT/s at JEDEC to 6000 MT/s on AM5 platform, it gained 33.6 % read performance, 23.7 % write performance, 21 % copy performance and further reduced 17.1 % latency in AIDA64 test, and the "FF14 Golden Legacy_FINAL FANTASY XIV: Dawntrail Official Benchmark" game test was improved from 12728 to 12757 SCORE, gaining 0.2 % score improvement.

In the temperature test, XPG LANCER BLADE DDR5 6000 MT/s CL28 2x 16GB RAM without additional fan cooling, the maximum temperature of SPD HUB is 64.8°C, which is OK and not too hot.