DDR5 memory with four full inserts! Gigabyte Flame Gun DDR5 6000 192GB Memory Unboxing Review

G.SKILL Flare X5 DDR5 6000 CL28 192GB (4x48GB) Memory Kit is a 48GB dual-channel memory package with 4DIMMs, four DS (Double Sided) cells and 2R (2 Rank) layout, providing a high-performance package for high-end gaming gamers, content creators and professional users who need high-capacity memory and low-latency overclocking. High-end gamers, content creators, and professional users who need high-capacity memory and low-latency overclocking are offered a high-performance package with a built-in burn-in AMD EXPO One-Click Overclocking Profile, which allows users to overclock up to DDR5 6000 MT/s CL28 in one go on motherboards that have passed the QVL compatibility test! This time, the author also manually overclocked to DDR5 6000 MT/s CL26 with four modules installed!

G.SKILL Chips Ahoy Flare X5 Flame Gun DDR5 6000 MT/s 192GB (4x48GB) CL28 Memory Specifications:

QVL Inquiry: Black F5-6000J2836G48GX4-FX5 / White F5-6000J2836G48GX4-FX5W
Memory Capacity: 192GB (4x48GB)
Overclocking frequency: DDR5 6000 MT/s
Overclocking Timing: CL28-36-36-96
Overclocking voltage: 1.4V
Specification: 288-Pin DDR5 UDIMM
Warranty: Lifetime Warranty
Dimensions: 133.35 x 80 x 33 mm (length x thickness x height)
Profile Parameters: AMD EXPO Certified (Extended Profiles for Overclocking)

High Capacity Low Timing G.SKILL Flare X5 Flare Gun DDR5 6000 CL28 192GB (4x48GB) Memory Unboxing

G.SKILL launched the DDR5-6000 CL28 192GB (48GBx4) high-capacity module specification in a press release in March of this year, which is definitely good news for professionals using consumer-grade platforms. Starting from the release of the specification in 2020 and the start of mass production of usable DDR5 platforms in 2021, the mass production and sale of DDR5 memory has been in effect for four years now. It has been four years since DDR5 memory was actually mass-produced and sold. In the past four years, due to poor platform support, the market has only dared to recommend 2DIMMs dual-channel DDR5 overclocking module installations, but this year, motherboard and memory module manufacturers have gradually begun to optimize their dual-channel DDR5 overclocking memory modules for 4DIMMs.

The G.SKILL Flare X5 Flame Gun DDR5 6000 CL28 192GB (4x48GB) memory that we are going to unbox today is a DDR5 memory high-capacity module set with AMD EXPO (Extended Profiles for Overclocking) Profile, which is tailor-made for the AMD Ryzen series processor platforms. The DDR5 Memory High-Capacity Module Kit is a set of four DDR5 Flare X5 U-DIMMs with AMD EXPO (Extended Profiles for Overclocking) Profile, specifically designed for AMD Ryzen series processor platforms. This kit contains 4DIMMs of four DDR5 Flare X5 U-DIMMs, which allows consumer motherboard platforms to expand 192GB (4x48GB) of memory space and easily overclock to achieve more bandwidth and lower latency performance than JEDEC specifications.

∆ G.SKILL Chips Ahoy Flare X5 Flame Gun DDR5 6000 CL28 192GB (4x48GB) Memory.

∆Packed in blister packs with two memories on the front and two on the back.

∆ AMD EXPO One-Click Overclocking Profile is included.

∆ Overclocking memory usage warning, please read it carefully before using.

 

The Flare X5 Flame Gun is a DDR5 memory model specially designed by Chips Ahoy for AMD Ryzen series processor platforms. For the unboxing of the DDR5-6000 MT/s CL28-36-36-96 1.40V 192GB (4x48GB), the memory model has AMD EXPO (Extended Profiles for Overclocking) one-click overclocking profile written on board, which enables the overclocking parameters to be turned on through the BIOS for better performance on AM5 platforms that have passed QVL validation tests. Profiles for Overclocking (EXPO) profile is built-in to enable overclocking parameters via BIOS for better memory performance on AM5 platforms that have passed the QVL validation test.

This series of memory modules are available in two colors, Eclipsing Black and Extreme White. The module body uses aluminum alloy heat sinks, but the two colors use different surface treatments: Eclipsing Black uses sandblasted surfaces, while Extreme White uses high-quality baked enamel paint, and each side of the heat sinks is equipped with about half of the area of the heat sinks to bring about better heat dissipation, and the height of the heat sinks is only 33 mm, which is more compatible with the installation of a dual-tower air-cooled radiator. The height of the heatsink is only 33 mm, making it more compatible with dual-tower air-cooled coolers, and although there is no RGB light bar, it is more suitable for low-profile style installations!

Compared to the Royal Halberd and Flame Halberd series, the Flare X5 Flame Gun is a price-performance model, which is cheaper than the other series under the same frequency and capacity specifications.

∆ Flare X5 Flame Gun Eclipsed Black Style.

The surface of the ∆ heatsink is stamped with Racing Style elements in clean lines, with classic striped red, white and gray accents.

The ∆ heatsink is made of aluminum alloy and the black model has a sandblasted finish.

The front and back of the ∆ heatsink are designed with the same mirror surface, and the heatsink holes take up about half of the area of one side.

 

The memory configuration is DS (Double Sided) with 2R (2 Rank) layout, and the single memory DRAM IC Count specification consists of sixteen 3 GB (3072 MB) DRAM cells.

∆ DS (Double Sided) Double Sided particles, 2R (2 Rank), sixteen 3 GB (3072 MB) particles.

The ∆ side view of the SPD HUB and PMIC area "should have" been equipped with thermal pads to help dissipate heat.

The top of the ∆ has only the G.SKILL text and no RGB light bar.

∆ Actual with 4DIMMs motherboard insertion demonstration.

∆ In fact, the heat sink is still quite dense when plugged in.Memory fan is included on the motherboard.Accessories and other recommended installations allow for better cooling of the four memory sticks.

 

The G.SKILL Gigabyte Flare X5 Flame Gun tested this time can be overclocked to DDR5-6000 MT/s CL28-36-36-96 1.40V after turning on the EXPO Profile which is burned into the SPD HUB. However, since it is a 4-bay 4DIMMs module, it is more important to look at the memory QVL (Qualified Vendor List) compatibility verification list because some motherboard manufacturers may not have prepared the 4-bay memory module installation optimization at this stage. Vendor List (Qualified Vendor List), because some motherboard manufacturers may not be ready to install the four memory modules at this stage, in order to avoid unavailability problems, it is recommended that the average consumer first check the QVL to confirm whether your motherboard is compatible with the memory modules you want to buy, and for more QVL inquiries or memory related questions you can refer to the website "DDR5 Memory Common Problems and Related SolutionsThe Article.

The Flare X5 Flame Gun DDR5-6000 CL28-36-36-96 1.40V 192GB (4x48GB) specification also has a QVL on G.SKILL's official website, the black QVL serial number is F5-6000J2836G48GX4-FX5, and the white color that can be recognized is F5-6000J2836G48GX4-FX5W, while the current QVL is AMD Ryzen 9000 series processor with Co-Asus and Little Lizard. 6000J2836G48GX4-FX5W, and the current QVL on Gigabyte's official website is for AMD Ryzen 9000 series processors with ASUS and Little Lizard motherboards, while ASRock and Gigabyte motherboards have not yet been posted on Gigabyte's official website, so you can check the official website of the motherboards that you are using if you need to.

∆ Flare X5 Flame Gun DDR5 6000 CL28 192GB (4x48GB) Memory (F5-6000J2836G48GX4-FX5) is currently listed on the QVL Motherboards list on our own official website.

 

Four sticks of DDR5 memory is four channels? Not at all!

Previously in Taiwan sales channels, the author saw that Price Hut used the term "quad channel" when selling other brands of quad-bar memory module products, so I can only say that this is the professional level of Price Hut?

In fact, the consumer-grade DDR5 UDIMM platform (usually we are familiar with the X870E/Z890 and other platforms) is only dual-channel (Dual-Channel mode) bandwidth specifications only, not you insert four is called four-channel discouragement, in fact, a more accurate use of the 4DIMMs should be 4 Dual-Channel Memory Modules are more appropriate, can only say that the price increase in the house to sell things! Shouldn't we be more professional? It is really ridiculous to make such jokes.

The only so-called quad-channel memory available today is on HEDT platforms or workstation platforms that are compatible with G.SKILL G5 Neo, G5, T5 Neo R-DIMM (RDIMM) memories, which are the so-called WRX90, W790 (Workstation), and TRX50 (HEDT) motherboard chipsets that have quad-channel or even more. The so-called WRX90, W790 (Workstation) and TRX50 (HEDT) motherboard chipsets are the only ones with four or more memory channels.

∆Consumer UDIMM memory is not called quad-channel just because you insert four of them. Consumer platforms have only dual-channel divided into four memory slots.

 

What should I do if I want to fill up four DDR5 memory sticks?

To plug in four DDR5 memory modules on a consumer platform, here are some of the things you can do to further increase the chances of stable usage of the built-in overclocking profile with a single click.

1. Instead of purchasing two sets of two memory modules to mix and match, you can purchase a set of four memory modules, such as the G.SKILL Flare X5 Flame Gun DDR5 6000 CL28 192GB (4x48GB) Memory Module Set, which is in this unboxing.
2. It is recommended to select motherboards, processor series, and memory modules that meet the QVL (Qualified Vendor List) compatibility list, and try not to miss any.
3. If budget permits, try to choose a higher-end motherboard model, as higher-end or flagship models have better PCB materials for better compatibility with 2R high-capacity quad-bar memory insertion, and it is recommended to update the BIOS to the latest version.
4. The processor is recommended to be selected according to the series indicated in the QVL list, and the memory controller of the processor itself will also affect whether it can pass the self-test or stabilize the use, but this part is a lottery for the average consumer, and it depends on the luck of the draw.
5. The four memory modules are installed in accordance with the SN last two codes in the order of installation, some module brand shipment verification may be in accordance with the order of their test to number, the insurance point in accordance with the last two codes in the order of sequence.
6. Enhance memory cooling planning if the motherboard accessories are not compatible with the memory. GIGABYTE Z890 AORUS MASTER、X870E AORUS MASTER A memory fan is also available and is recommended to be used in conjunction with a memory fan to enhance memory cooling and bring more stable usage.
7. For the rest of the BIOS settings, you can refer to the "BIOS Setup" on this site.DDR5 Memory Common Problems and Related SolutionsThe Article.

 

Intel Core Ultra 9 285K with ASRock B860 Steel Legend WiFi Platform Memory Performance Testing

Testing Platform

Processor:Intel Core Ultra 9 285K QS
Cooler: Valkyrie E360 (full speed)
Water-cooled fan: LIAN LI UNI FAN P28 (full speed)
Motherboard:ASRock B860 Steel Legend WiFi ( BIOS version: 2.06)
RAM: G.SKILL Flare X5 DDR5 6000 CL28 192GB (4x48GB) CL28-36-36-96 1.40V
Graphics: NVIDIA GeForce RTX 4060Ti Founders Edition
Operating System: Windows 11 Professional 24H2
System Drive: Plextor PCIe Gen3 x4 M.2 2280 SSD 512GB
Game Dish:XPG GAMMIX S70 PRO PCIe Gen4 x4 M.2 SSD 4TB
Case: STREACOM BC1 Benchtable V2

 

In the motherboard's BIOS, you can see that this memory has a built-in Profile overclocking profile, DDR5 6000 MT/s CL28-36-36-96 1.40V for AMD EXPO.

In the author's hands Intel Core Ultra 9 285K 與 ASRock B860 Steel Legend WiFi The platform can directly apply the EXPO Profile through the self-test and test without additional manual overclocking adjustments, Intel remaining memory overclocking ability to speak at this time actually play a role.

∆ DDR5 Profile View, 2025 Week 37 Production, Richtek JEDEC PMIC.

 

由 CPU-Z Looking at the test platform, the SPD page shows that the G.SKILL Flare X5 Flame Gun DDR5 6000 CL28 192GB (4x48GB) memory uses SK Hynix cells and supports the latest AMD EXPO (EXtended Profiles for Overclocking) one-click overclocking profile. Profiles for Overclocking.

However, only one set of Profile parameter is programmed in the SPD HUB, the rest are JEDEC timing frequency parameters.

∆ Intel platform CPU-Z.

 

AIDA64 Cache & Memory Benchmark It is mainly used to test the performance of processor caches and RAM. The read/write/copy bandwidth performance score represents the rate of transfer between CPU and memory, which means the efficiency of data throughput (the higher the score, the better), and the time delay score of accessing data indicates the responsiveness of the memory system.

With EXPO Profile 1's DDR5-6000 CL28-36-36-96 1.40V turned on, read speeds were 83.1 GB/s, write speeds were 74.7 GB/s, copy speeds were 77.9 GB/s, and latency was 97.8 ns.

∆ EXPO Profile 1: DDR5-6000 CL28-36-36-96 1.40V_Intel Platform Test Results.

 

OCCT Memory Benchmark Configuration The benchmark performance test, which is conducted on memory, yields three scores, each representing the memory's read performance, the memory's write performance, and the memory's performance in a simultaneous read/write test.

LATENCY / BANDWIDTH BENCHMARK CONFIGURATION represents the delay and bandwidth of the memory.

∆ EXPO Profile 1: DDR5-6000 CL28-36-36-96 1.40V_Intel Platform Test Results.

∆ EXPO Profile 1: DDR5-6000 CL28-36-36-96 1.40V_Intel Platform Test Results.

 

OCCT Memory Benchmark Configuration Benchmark performance testing of Custom mode, which graphically displays the latency, read, and write of the memory when tested at different file sizes (8 KiB to 4 GiB).

∆ EXPO Profile 1: DDR5-6000 CL28-36-36-96 1.40V_Intel Platform Test Results.

 

RAM Test Pro Memory Benchmark Designed to measure the performance of DDR5, DDR4, DDR3, and DDR2 memory, the software can test the performance of (1) sequential read, write, and copy bandwidths / (2) random read, write, and copy bandwidths / (3) read/write latency / (4) latency for random accesses to blocks of different sizes.

∆ EXPO Profile 1: DDR5-6000 CL28-36-36-96 1.40V_Intel Platform Test Results.

 

What should I do if I have four DDR5 memory sticks full and can't use them smoothly? ft. ASRock X870E Taichi

What should I do if my motherboard is not listed in the QVL list and cannot pass the self-test after opening the EXPO Profile? This time with AMD Ryzen 9 9950X3D The processor and ASRock X870E Taichi motherboard will be updated to version 3.33 to demonstrate the parameters that can be adjusted for the reference of gamers using the same configuration, but it is not recommended to copy the platform using different processors, motherboards, memory modules, and BIOS versions.

*Note! The following operations are only guaranteed to be available on the author's hands on this set of processors, motherboards, memory module suite test platform, there is no guarantee that other platforms can be used, manual parameter adjustment overclocking is a risk, please refer to the use of caution, and will not be held responsible.

 

The author has an AMD AM5 platform using the AMD Ryzen 9 9950X3D The processor and ASRock X870E Taichi motherboard, both G.SKILL Flare X5 Flame Gun DDR5 6000 CL28 192GB (4x48GB) memory and ASRock X870E Taichi motherboard don't have each other's QVLs on the official website, and the EXPO Profile of the memory module failed to pass the self-test after I applied it. After confirming with ASRock, the reason is that there is no plan yet to import the four memory module optimization auto rules into the BIOS, but there should be in the future. At this stage, I have asked ASRock overclocking engineers what settings can be adjusted in order to pass the self-test by adjusting the smallest settings, for everyone's reference.

After purely applying EXPO Profile DDR5-6000 CL28-36-36-96 1.40V failed, re-entering BIOS and making the following settings, it passed the self-test of the motherboard and conducted the following tests, the fan full-speed setting, TDP to 105W, and PBO setting are the author's personal overclocking habit settings, which can be chosen according to one's own usage needs. (Some of the settings are too many English words, so I use abbreviation instead, please follow the screenshot to refer to F4 to search by the full name.)

• RTT_NOW_WR:RTT_OFF
• RTT_NOW_RD:RTT_OFF
• rtt_wr:rzq/2(120)
• RTT_PARK:RZQ/6(40)
• DQS_RTT_PARK:RZQ/6(40)
• SoC Voltage (VDDCR_SOC): 1.25V (not recommended to exceed 1.25V)
• TX DFE Taps:1 Tap
• RX DFE Taps:1 Tap
• pull up p0:48 ohm
• pull Down P0:120 ohm

∆ AMD Ryzen 9 9950X3D processor and the ASRock X870E Taichi motherboard (version 3.33), the BIOS manual adjustment parameters can be referenced when using the F5-6000J2836G48GX4-FX5.

 

AMD Ryzen 9 9950X3D and ASRock X870E Taichi Platform Memory Performance Tests

Testing Platform

Processor:AMD Ryzen 9 9950X3D (PBO activated)
Cooler: LIAN LI GA II Trinity SL-INF 360 (full speed)
Water cooling fan: 3x XPG VENTO PRO 120 PWM (full speed)
Motherboard: ASRock X870E Taichi motherboard (BIOS version: 3.33)
Memory: G.SKILL Flare X5 DDR5 6000 CL28 192GB (4x48GB) CL28-36-36-96 1.40V (with manual overclocking adjustment setting)
Graphics: NVIDIA GeForce RTX 4060 Ti Founders Edition 8GB
Operating System: Windows 11 Professional 24H2
System hard disk:Kingston FURY Renegade PCIe 4.0 NVMe M.2 SSD 2TB
Power supply:MONTECH TITAN PLA 1000W
Case: STREACOM BC1 Benchtable V2

 

By the same token CPU-Z to review the testbed specification and related information.

This AMD AM5 platform was not tested using the memory EXPO Profile alone, but was adjusted to pass the motherboard self-test, so the performance section is for reference only.

AIDA64 was updated during the author's B860 and X870E tests on different days. I finished the X870E test first and the B860 was updated when I started the test, so it would be a waste of my time to re-test it, so I didn't re-test it, and because the two platforms have different versions of AIDA64, based on the principle of fair comparison, I don't recommend a direct side-by-side comparison between the two platforms in this article.

∆ AMD platform CPU-Z.

 

AIDA64 Cache & Memory Benchmark It is mainly used to test the performance of processor caches and RAM. The read/write/copy bandwidth performance score represents the rate of transfer between CPU and memory, which means the efficiency of data throughput (the higher the score, the better), and the time delay score of accessing data indicates the responsiveness of the memory system.

With EXPO Profile 1's DDR5-6000 CL28-36-36-96 1.40V turned on, read speeds were 69.5 GB/s, write speeds were 77.2 GB/s, copy speeds were 64.2 GB/s, and latency was 92.3 ns.

∆ EXPO Profile 1: DDR5-6000 CL28-36-36-96 1.40V_AMD Platform Test Results.

 

Manual overclocking adjustments to minor parameters were then tested, and the memory bandwidth performance was further improved by maintaining the DDR5-6000 MT/s CL28-36-36-96 1.40V major setting, with read speeds of 79.5 GB/s, write speeds of 85.5 GB/s, copy speeds of 74.4 GB/s, and latency of 74.6 ns.

∆ Maintains EXPO Profile 1, but down-regulates manual overclocking settings_AMD platform test results.

 

OCCT Memory Benchmark Configuration The benchmark performance test, which is conducted on memory, yields three scores, each representing the memory's read performance, the memory's write performance, and the memory's performance in a simultaneous read/write test.

LATENCY / BANDWIDTH BENCHMARK CONFIGURATION represents the delay and bandwidth of the memory.

∆ EXPO Profile 1: DDR5-6000 CL28-36-36-96 1.40V_AMD Platform Test Results.

∆ EXPO Profile 1: DDR5-6000 CL28-36-36-96 1.40V_AMD Platform Test Results.

 

OCCT Memory Benchmark Configuration Benchmark performance testing of Custom mode, which graphically displays the latency, read, and write of the memory when tested at different file sizes (8 KiB to 4 GiB).

∆ EXPO Profile 1: DDR5-6000 CL28-36-36-96 1.40V_AMD Platform Test Results.

 

RAM Test Pro Memory Benchmark Designed to measure the performance of DDR5, DDR4, DDR3, and DDR2 memory, the software can test the performance of (1) sequential read, write, and copy bandwidths / (2) random read, write, and copy bandwidths / (3) read/write latency / (4) latency for random accesses to blocks of different sizes.

∆ EXPO Profile 1: DDR5-6000 CL28-36-36-96 1.40V_AMD Platform Test Results.

 

After applying the settings from the author's previous BIOS screenshot, use the RAM Test Pro The built-in test is a 180-minute (author's bedtime available time) stress test, after the test is No errors, if you want to use it more stable you can test it for a longer time to see if your platform can pass the test for a longer period of time.

∆ Three-hour pressure test reference.

 

Dual-Channel mode performance difference test with four versus two memory modules installed.

In the past, the author has always been curious about the difference in memory bandwidth performance when using the same platform with the same design by simply installing two and four of the same modules. However, for those who will buy the 192GB (4x48GB) large capacity memory package, the more pressing need than memory bandwidth performance is still the expansion of memory space, so this test is purely a personal curiosity of the author.

The EXPO Profile can be applied directly and passed the self-test of the motherboard. Intel Core Ultra 9 285K 與 ASRock B860 Steel Legend WiFi platform, install two 96GB (2x48GB) in the AIDA64 Cache & Memory Benchmark The read, write, and copy performance is better than installing four 192GB (4x48GB) strips, and the latency performance is about the same.

In terms of Intel platform, since we can directly apply EXPO for testing, it's fairer to compare directly. The author's "guess" is that installing two 96GB (2x48GB) bandwidths is better than installing four 192GB (4x48GB) bandwidths for the following reasons, so please leave a comment if you have any more ideas.

1. Installation uses four 192GB (4x48GB) alignment layout signal impacts.
2. Those with two installed may have auto rule performance optimizations; those with four have not yet been imported into the BIOS.
3. Dual-Channel Dual-Channel mode bandwidth for consumer platforms evens out the performance loss after four slots.

∆ EXPO Profile 1: DDR5-6000 CL28-36-36-96 1.40V_Intel platform with two 96GB (2x48GB) installed Test results.

 

In addition to applying the memory EXPO Profile, there is also the option to manually adjust the BIOS settings. AMD Ryzen 9 9950X3D The processor and ASRock X870E Taichi motherboard test platforms are also for reference only, as the performance of the memory itself cannot be fully represented due to manual adjustments to some settings.

On the AMD side, the same two 96GB (2x48GB) are also installed on the AIDA64 Cache & Memory Benchmark In the case of the 192GB (4x48GB), the bandwidth performance is a little better than installing four 192GB (4x48GB) bars in all aspects, including latency performance.

∆ EXPO Profile 1: DDR5-6000 CL28-36-36-96 1.40V_AMD platform with two 96GB (2x48GB) installed Test results.

 

Quad DDR5 6000 CL26 achieved! Dual-Channel mode overclocking testing

This time, with G.SKILL Flare X5 Flare Gun DDR5 6000 CL28 192GB (4x48GB) memory plugged in and full, using the AMD Ryzen 9 9950X3D The processor and ASRock X870E Taichi motherboard test platform were subjected to a low-timing overclocking challenge, and finally succeeded in overclocking four DS (Double Sided) double-sided cells, 2R (2 Rank) memory to DDR5 6000 MT/s CL26-36-36-96 1.45V, and scored by AIDA64.

∆ Four G.SKILL Gigabyte Flare X5 Flame Gun DDR5 192GB (4x48GB) Memory Overclocking Challenge.

∆ Dual-sided 2R memory DDR5 6000 MT/s 192GB (4x48GB) CL26 achieved.

 

Memory Thermal Performance Test

And then through OCCT MEMORY CONFIGURATION To test the pressure stability of the memory, the software was manually set to load the memory at 99%, the memory test was set to memory EXPO Profile 1 parameter DDR5-6000 CL28-36-36-96 1.40V, and the test scenario was to conduct the actual test in a closed air-conditioned room with an indoor temperature of 25 °C. The data was collected using HWiNFO64 to collect and record the temperature of the SPD Hub after one hour of testing, with a maximum temperature of 77.5 °C on AMD platform and 99.8 °C on Intel platform. Data was collected using HWiNFO64 to collect and record the temperature of the SPD Hub after one hour of testing, with a maximum temperature of 77.5 °C on AMD platforms and 99.8 °C on Intel platforms.

It is important to note that the test platform is placed on the Streacom BC1 bare test platform, and there is no additional fan in the memory to assist in cooling, but most users will install an exhaust fan on top of the chassis to assist in the cooling process, the author's test environment and the test software are more severe than the daily use of the test software, so this side of the temperature test is for reference only.

On the Intel platform, which can be directly applied to EXPO, the maximum temperature of SPD Hub is 99.8°C, which is very high without the help of fans to dissipate the heat. The author is not sure why the temperature is so high on the Intel platform, and it may depend on the future situation after the BIOS optimization.

∆ Fanless OCCT MEMORY CONFIGURATION temperature and pressure test, SPD Hub up to 99.8 °C, Intel test platform temperature is obviously very high.

∆ The surface temperature of the heatsinks was viewed using a FLIR ONE PRO thermal imaging camera. The highest temperature was 96.6 °C for the memory in the DIMM2 slot.

 

In addition to applying the memory EXPO Profile, there is also the option to manually adjust the BIOS settings. AMD Ryzen 9 9950X3D The processor and ASRock X870E Taichi motherboard test platforms were a bit cooler, with the SPD Hub reaching a maximum temperature of 77.5 °C. The SPD Hub was also a bit cooler than the ASRock X870E Taichi motherboard test platform.

∆OCCT MEMORY CONFIGURATION temperature stress test without fan, SPD Hub is up to 77.5 °C, additional manual adjustment of AMD test platform temperature is relatively normal.

∆ Using the FLIR ONE PRO thermal imaging camera to look at the surface temperature of the heatsinks, the highest temperature was for the memory in the DIMM2 socket, at 77.3 °C. The highest temperature was for the memory in the DIMM2 socket.

 

Conclusion

This unboxing test of G.SKILL Flare X5 Flame Gun DDR5 6000 CL28 192GB (4x48GB) memory is a 4DIMMs four-strip memory module set arranged by G.SKILL for the demand of memory capacity expansion, especially for rendering, editing, retouching and other purposes of professional work demanders will especially need this kind of large-capacity memory module set. Large-capacity memory module package, I previously used LR to output a single 2000 photos of the project, at that time, 32 GB memory capacity became the reason why my platform ran for a long time, the next should not have to worry about it!

This set of mass memory configuration is DS (Double Sided) with 2R (2 Rank) layout, but with AMD EXPO (Extended Profiles for Overclocking) one-click overclocking profile, it can be overclocked to DDR5-6000 CL28-36-96 1.40V right after the BIOS is turned on. 36-96 1.40V, double-sided cell memory with four full strips and direct EXPO overclocking to 6000 MT/s CL28. This was unimaginable before this year, Gigabyte uses high-quality ICs that have passed rigorous testing and high-grade materials to provide excellent and extreme performance memory in order to achieve previously unattainable innovations and mass production, but the corresponding "price" is a barrier to people. But the corresponding "price" is a barrier to entry.

To shrimp skin G.SKILL officially licensed flagship store sold before the flame spearhead halberd RGB 6000 CL28 192GB (4x48GB) memory, the price at that time in the 28990~30990 yuan, and we write the same specifications to compare, the price should be estimated to be more than 26,000, right.

Nowadays, as the memory performance of motherboard platforms is gradually optimized, it is gradually becoming "feasible" to overclock with four strips of DDR5 memory plugged in and applying the AMD EXPO Profile. However, processors, motherboards, BIOS optimization, and a set of four memory kits are still indispensable, so it is still necessary to check and confirm the QVL (Qualified Vendor List) compatibility list, and the author's actual use is not on the QVL list. Vendor List (QVL) is still a necessity, and the author's actual use this time is not on the QVL list. ASRock B860 Steel Legend WiFi The ASRock X870E Taichi motherboard was tested with the Intel platform, and it can pass the self-test by applying the built-in EXPO directly to the memory, while the AMD platform has to adjust the settings to pass the self-test, so it seems that we have to wait for the ASRock BIOS team to plan for it, but it is still "strongly recommended" for the general consumers to follow the platforms listed in the "QVL" list. However, for general consumers, it is still highly recommended to follow the QVL list to use the platform. If the installation still fails to pass the self-test according to the QVL, and still fails to work after basic debugging and updating, then you can justifiably approach the motherboard maker and Gigabyte's customer service.

 

The author also manually overclocked the AMD AM5 platform in the AMD Ryzen 9 9950X3D The processor and ASRock X870E Taichi motherboard successfully overclocked four Flare X5 Flame Gun DDR5 192GB (4x48GB) memory up to 6000 MT/s CL26, but unfortunately, CL24 can only be accessed in split-speed mode, which is not good enough for the author's personal requirements!

While installing four memory modules to expand the capacity, it is also recommended to pay attention to memory cooling planning! If the motherboard itself has a memory cooling fan, it is recommended to install it to further enhance the memory cooling effect to bring better stability and service life, after all, the stronger the cooling, the better, of course, the measured DIMM2 and DIMM3 in the middle of the sandwich have the highest temperature, DIMM1 and DIMM4 near the processor and near the 24-Pin side of the lower temperature, and the inside and the outside are the highest! The temperature difference between the inside and the outside is up to 20 °C.