MSI MEG X670E ACE Motherboard Unboxing Test / 6x M.2, 22+2+1 90A Power Supply
The 22+2+1 DUET RAIL 90A VRM architecture and 8-layer PCB design liberates the most powerful performance for AMD Ryzen 7000 series processors, providing up to six M.2 expansion slots and 192 GB of DDR5 memory expansion, as well as a flagship specification such as 10G LAN, Wi-Fi 6E, Lightning Gen5 x4 M.2, and a USB 3.2 Gen 2×2 with a 60W PD fast charger on the front. With flagship specifications such as 10G LAN, WiFi 6E, Lightning Gen5 x4 M.2, USB 3.2 Gen 2×2 with front 60W PD fast charging, and so on, this motherboard can only be said to be above all others in terms of expandability, and that one person, “GODLIKE”, won't even be present in Taiwan!
MEG X670E ACE Specification:
Size: E-ATX 27.7 x 30.4 cm
Processor Support: AMD Ryzen 7000
Processor Pin: AM5
CPU Power Phase: 20+2+1 90A Duet Rail Power System (DRPS)
Chipset: AMD X670
Memory: 4x DDR5 DIMMs, 192 GB max, DDR5-6000+(OC) MHz
Memory Certification: AMD EXPO (EXTended Profiles for Overclocking)
Display output: 1x Type-C DisplayPort (DisplayPort High Bit Rate 3 [HBR3])
Expansion slots: PCIe 5.0 x16, PCIe 5.0 x8 (x16 slots), PCIe 5.0 x4 (x16 slots)
Storage slots: 6x SATA 6Gb/s, M.2_1 2280/2260 PCIe Gen5 x4, M.2_2 2280/2260 PCIe Gen4 x4, M.2_3 2280/2260 PCIe Gen4 x4, M.2_4 22110/2280 PCIe Gen4 x4
Network: Marvell AQC113CS-B1-C 10Gbps LAN
Wireless: AMD RZ616 Wi-Fi 6E, BT 5.3
Audio: Realtek ALC4082 Codec, ESS ES9280AQ Combo DAC/HPA 7.1 channel
USB Ports (Front Expansion): 1x USB 3.2 Gen 2×2 Type-C, 1x USB 3.2 Gen 2 Type-C, 2x USB 3.2 Gen 1 (supports front four USB 3.2 Gen 1 ports), 2x USB 2.0 (supports front four USB 2.0 ports)
USB Ports (Rear I/O): 2x USB 3.2 Gen 2×2 Type-C, 1x USB 3.2 Gen 2 Type-C Display port, 8x USB 3.2 Gen 2 Type-A
RGB: 3x ARGB_V2 5v-3pin, 1x RGB 12v-4pin
FAN: 1x 4-Pin CPU Fan, 2x 4-Pin PUMP FAN, 5x 4-Pin System FAN
MEG X670E ACE Motherboard Unboxing
This time for gamers to open the box MSI launched last year's AM5 sub-flagship model MEG X670E ACE, product positioning is second only to the MEG X670E GODLIKE, but in fact, Taiwanese consumers can only see the MEG X670E ACE in the channel to choose from, MEG X670E GODLIKE is not officially on sale in Taiwan, may be out of stock! MEG X670E GODLIKE is not officially sold in Taiwan, probably due to out-of-stock, but also because of the business sales strategy, that is to say, if you want to buy MSI X670E motherboards, the highest in Taiwan is only the ACE option, and the lower level is the X670E CARBON WIFI (UNIFY completely disappeared in this year...).
As part of MSI's flagship MEG series, the MEG X670E ACE uses the same black and gold color scheme as the MEG Z790 ACE for a unique and premium aesthetic look.
As a first generation AM5 motherboard chipset, the MEG X670E ACE has plenty of expandability, and in contrast to other motherboards that require disabling the channel embarrassment, the X670E offers a much more versatile use of bandwidth (albeit with channel splitting in some cases).
∆ MEG X670E ACE.
∆ Motherboard product features.
∆ LUSTROUS AESTHETICS PURE PERFORMANCE.
The MEG X670E ACE is an E-ATX version measuring 27.7 x 30.4 cm and has ample expansion slots for expansion performance, but it is important to be aware of whether or not the chassis supports E-ATX motherboards.
The MEG X670E ACE is an AM5 (LGA 1718) X670E motherboard that supports AMD Ryzen 7000 series processors and retains the same heatsink grommets and hole spacing as the AM4 motherboards, allowing gamers to install the motherboard directly along the AM4 heatsink grommet set.
The motherboard VRM power supply and PCH chipset blocks are equipped with large area heat sinks. The motherboard power supply uses stacked cooling fins and direct-contact heat pipes to increase the heat dissipation area, and high-quality 7W/mK MOSFET cooling pads and additional choke pads are used to ensure that the heat can be fully conducted to the heat sinks, and the back of the motherboard's MOSFET backplane is made of sturdy metal, which helps reduce the MOSFET temperature. The MOSFET backplane on the back of the motherboard is made of sturdy metal, which helps to reduce the temperature of the MOSFETs.
∆ MEG X670E ACE in E-ATX version (27.7 x 30.4 cm).
∆ The motherboard's reinforced backplane also has a dragon pattern.
The ∆ can directly follow the AM4 heatsink.
∆ AM5 LGA 1718.
Let's take a look at the expansion and power supply slots on the MEG X670 ACE motherboard. There is an 8+8 Pin CPU power supply slot on top of the memory slots, and a JSMB1 slot on the top left corner of the motherboard for connecting the M.2 Xpander-Z Gen 5 Dual card from the accessories. After connecting, you can configure the card's fan speed and the M.2 temperature LED color display in BIOS. Once connected, you can set the fan speed and M.2 temperature LED color display in the BIOS.
∆ ATX_12V Dual 8-Pin processor power supply slots above the memory slots.
∆ JSMB1 slot.
Quad-slot dual-clip DDR5 DIMMs memory slots, supports DDR5 non-ECC, unbuffered memory installation, memory overclocking up to 6000+ (OC) MT/s (subject to the official memory QVL table), expandable up to 192 GB of memory capacity, with a maximum of 48 GB of memory installed on a single memory stick. The maximum memory capacity can be expanded up to 192GB, with a maximum of 48GB installed on a single memory stick, and supports AMD EXPO (EXTended Profiles for Overclocking) memory certification.
However, after updating to the latest AMD AGESA PI 1.0.0.7c firmware version of the BIOS, it will be able to support higher frequency DDR5 memory, and MSI has officially tested the MEG X670 ACE motherboard with this 4 DIMM memory slot, and it was able to pass the stress test with DDR5 8000 MT/s CL36 frequency.
For the 2 DIMM dual-channel memory kits that are often purchased when ordering, the original manufacturer recommends that they be installed in slots A2 and B2 (the second and fourth slots counting from the left), so that the memory can operate at a higher frequency with the two memory sticks installed in these two locations.
∆ 4DIMM DDR5, 192 GB, EXPO.
The right half of the motherboard is equipped with CPU_FAN1, PUMP_FNA1, 3x SYS_FAN, EZ Debug LED, debug LED, motherboard 24-Pin power supply, PD_PWR1 auxiliary power supply, JUSB1 (USB 3.2 Gen 2 10Gbps Type-C), JUSB2 (USB 3.2 Gen 2×2 20Gbps Type-C), 2x USB 3.2 Gen1 slots (supporting four front USB 3.2 Gen1 ports), 6x SATA III 6Gbps Type-C, and 2x USB 3.2 Gen1 slots. 2 20Gbps Type-C), 2x USB 3.2 Gen1 slots (supports four front USB 3.2 Gen1 ports), 6x SATA III 6Gb/s slots.
The EZ Debug LED and debug code LED in the upper right corner of the motherboard can be used to quickly troubleshoot hardware problems. The EZ Debug LEDs are from top to bottom CPU / DRAM / VGA / BOOT, etc. The four LEDs represent the four core hardware, and if a certain light is constantly on during the boot self-test process, you can troubleshoot the problem based on the hardware as the core.
The hexadecimal debug code LEDs will display progress and error codes during and after boot-up, and the hexadecimal character table indicates more clearly where the PC problem is, and the detailed debug code LEDs can be queried directly in the official manual.
There is an additional PD_PWR1 power supply slot on the 24-Pin motherboard. By connecting the PCIe 6-Pin of the power supply to this slot, gamers will be able to enable the JUSB2 (USB 3.2 Gen 2×2 20Gbps Type-C) slot on the left to support USB PD 60W fast charging, while JUSB1 (USB 3.2 Gen 2×2 10Gbps Type-C) on the right "does not" support USB PD 60W fast charging. JUSB1 (USB 3.2 Gen 2×2 20Gbps Type-C) on the right "does not" support USB PD 60W fast charging.
support sth. USB PD 60W fast charging The JUSB2 (USB 3.2 Gen 2×2 20Gbps Type-C) slot does not support USB 2.0 devices for data transfer, which means that cheaper phones will not be able to connect to data on this slot, and will only be able to charge, such as the author's S21 FE, which will not be able to connect to the system.
So if you're using a cell phone with only USB 2.0 ports, you're not going to be able to use it. (Please check the official website of your phone model.) If you want to connect to this motherboard through the chassis I/O port to complete the data transfer between the phone and the system, you can only select theJUSB1 (USB 3.2 Gen 2 10Gbps Type-C) on the right.
∆ CPU_FAN1, PUMP_FNA1, SYS_FAN1, SYS_FAN2.
∆ EZ Debug LED, hexadecimal character debug code LED.
∆ Motherboard power supply, PD_PWR1 auxiliary power supply, USB 3.2 Gen 2 10Gbps Type-C, USB 3.2 Gen 2×2 20Gbps Type-C.
∆ 2x USB 3.2 Gen1, 6x SATA III 6Gb/s, SYS_FAN3.
On the bottom of the motherboard, there are V-Check Points Lite, 2x JARGB_V2 (5V 3-Pin ARGB Gen2), JLN1 (Low Temperature Mode Activation Jumper), JFP1 (System Panel Slot), JBAT1 (Clear CMOS Function Jumper), JOCFS1 (Security Activation Jumper), and the Power On button, Reboot button, 2x USB 2.0 (supports four front USB 2.0 ports), T_SEN1 / 2 (temperature sensor connector), W_FLOW1 (water flow meter connector), PUMP_FAN2, SYS_FAN5, Dual BIOS Physical Toggle Switch, LED Physical Switch, JPWRLED1 (LED Power Connector), JRGB(12V) 4-Pin RGB), Front Audio Slot.
The slots on the bottom of the MEG X670 ACE motherboard are relatively complex, and include slots that may be needed for overclocking, so it is recommended that gamers read the manual to understand the purpose of each slot.
∆ ARGB, chassis front I/O, boot/restart, 2x USB 2.0 slots.
∆ Lower Slot List.
There are also SYS_FAN4 and TPM module slots under the I/O armor on the rear of the ∆ motherboard.
The MEG X670E ACE provides three metal-reinforced x16 form factor slots, but each PCIe slot offers a different bandwidth: PCIe 5.0 x16 (x8), PCIe 5.0 x8, PCIe 5.0 x4. Unlike the MEG Z790 ACE, all PCIe slots in the X670E ACE are PCIe 5.0, which is not shared with the M.2 expansion slots and are connected by the processor. The X670 ACE is different from the MEG Z790 ACE in that all PCIe slots in the X670 ACE are PCIe 5.0, which does not have to share bandwidth with the M.2 expansion slots, and they are all directly connected by the processor.
Gamers should be aware that the second PCI_E2 still shares the PCIe 5.0 x16 bandwidth with the first PCI_E1, which means that it will operate as x16/x0/x4 or x8/x8/x4.
∆ PCIe 5.0 x16 (x8), PCIe 5.0 x8, PCIe 5.0 x4.
∆ Motherboard PCH heatsink.
MEG logo lighting effect on the ∆ PCH heatsink.
The M.2_1 LIGHTING GEN 5 slot located on the right side of the MEG X670E ACE memory slot provides PCIe Gen5 x4 bandwidth through the processor direct connect channel, supporting 2280 / 2260 M.2 NVME SSD expansion installations.
∆ SCREWLESS M.2 Fixed design LIGHTING GEN 5 slot.
∆ Thermal pads on top and bottom to support 2280 / 2260 M.2 PCIe Gen5 x4 SSD installations.
The remaining three M.2_2, M.2_3, and M.2_4 have PCIe Gen4 x4 bandwidth via the chipset lanes, with M.2_2 and M.2_3 supporting the 2280/2260 specification, and the bottom one, M.2_4, supporting 22110/2280.
∆ M.2_2 PCIe Gen4 x4, M.2_3 PCIe Gen4 x4, M.2_4 PCIe Gen4 x4.
∆ EZ M.2 CLIP.
∆ M.2 Heat sinks and thermal pads.
I/O on the rear of the motherboard includes Smart Button, Flash BIOS, Clear CMOS, USB 3.2 Gen 2×2 20Gbps (Type-C), USB 3.2 Gen 2 10Gbps (Type-C Display port), 8x USB 3.2 Gen 2 10Gbps (Type-A), USB 3.2 Gen 2×2 20Gbps (Type-A), Wi-Fi antenna port, Optical S/PDIF Out, HD Audio. ), USB 3.2 Gen 2×2 20Gbps (Type-C), Wi-Fi antenna port, Optical S/PDIF-Out, HD Audio.
The Smart Button allows you to set up system reboot, light on/off, security activation, fan acceleration, etc. in the BIOS, and there is a USB 3.2 Gen 2 10Gbps (Type-C) slot labeled with the Display logo, which supports the processor's internal display output to connect to the on-screen monitor.
∆ Rear I/O at a glance.
Motherboard extras include: Wi-Fi antenna kit, M.2 screws, 2x temperature sensing cables, RGB extension cables, 1 in 2 RGB cables, front panel I/O integration cables, 4x SATA cables, M.2 Xpander-Z Gen 5 Dual Expansion Card, and Driver USB, however, the X670E ACE I have in my hands is a media test so the Wi-Fi antenna kit was lost in half by the person in front of me. The Wi-Fi antenna is half lost by the person in front of me...
∆ Accessories at a glance.
∆ M.2 Xpander-Z Gen 5 Dual expansion card and driver USB.
In addition to the four onboard M.2 expansion slots, the MEG X670 ACE can also be used with the included M.2 Xpander-Z Gen 5 Dual expansion card, which can be installed in the PCIe 5.0 slot of the second slot to get two additional PCIe Gen5 x4 M.2 expansion slots, which means the MEG X670 ACE can have up to six M.2 x4 M.2 expansion slots. SSD expansion slots on the MEG X670 ACE.
However, it should be noted that before installing the M.2 Xpander-Z Gen 5 Dual Expansion Card, the PCIe Slot 1 and Slot 2 of the MEG X670 ACE will remain PCIe 5.0 x16 (PCI_E1) and PCIe 5.0 x0 (PCI_E2 is disabled) with AUTO setting, but will split into PCIe 5.0 x8 (PCI_E1) and PCIe 5.0 x8 (PCI_E2 is enabled) with the installation of the M.2 Xpander-Z Gen 5 Dual Expansion Card. Gen 5 Dual expansion card will split into PCIe 5.0 x8 (PCI_E1) and PCIe 5.0 x8 (PCI_E2 enabled).
The M.2 Xpander-Z Gen 5 Dual Expansion Card has an active fan to help cool the M.2 SSDs and requires an additional PCIe 6-Pin to power the card. It internally supports NVMe SSD expansion for M.2 22110 / 2280 / 2260 / 2230 form factor and comes with a real-time temperature detection for the M.2 SSDs, and the LEDs on the side of the card will indicate the operating and temperature conditions during operation. During operation, the LEDs on the side of the expansion card will display according to the operation and temperature conditions.
∆ Requires PCIe 6-Pin power supply.
∆ will use about 1.5 Slot of installation space.
∆ Two PCIe 5.0 x4 expansion locations.
The ∆ is equipped with a temperature sensor and an EZ M.2 clip.
∆ M.2 Operates and switches the fan operation LED on and off.
MSI MEG X670E ACE Power Supply / 22+2+1 Phase 90A DRPS
The MSI MEG X670E ACE motherboard utilizes a 22+2+1 Duet Rail Power System (DRPS) architecture VRM power supply, with 22 phases for the CPU Vcore, 2 phases for the SOC, and 1 phase for the MISC.
∆ The bare PCB of the motherboard is shown.
∆ The back of the motherboard is shown.
∆ Motherboard heatsink and reinforced backplane disassembly.
∆ 22+2+1 Duet Rail Power System (DRPS).
∆ 2 Infineon TDA21472 70 A vs. 22 Infineon TDA21490 90 A.
∆ 1 x MaxLinear MXL7630S 30 A.
∆ Two B650s in series with the X670 motherboard PCH chipset.
∆ Motherboard Channel Display.
∆ Infineon XDPE192C3 Motherboard power supply PWM controller.
∆ iTE IT8856FN USB PD 3.0 controller.
∆ Marvell AQC113CS-B1-C 10Gbps LAN.
∆ ESS ES9280AQ Combo DAC/HPA.
∆ winbond 25Q256JWEQ Dual BIOS chip.
∆ asmedia ASM1061 SATA chip.
∆ asmedia ASM1074 USB 3.2 Gen 1 5Gbps controller.
BIOS Function Setting Menu
After the motherboard passes the self-checking program, press the F2 or DEL button to enter the EZ MODE of the BIOS, where gamers can set up basic functions such as CPU GAME BOOTS overclocking, memory EXPO overclocking, and so on.
∆ MSI CLICKS BIOS EZ Mode.
For more detailed settings, press F7 in EZ Mode to enter Advanced Mode, which allows you to adjust voltage, frequency, or various parameters.
∆ F7 Enter Advanced Mode.
∆ SETTINGS Settings Page / Advanced.
The Re-Size BAR function can be turned on in ∆ SETTINGS/Advanced/ PCIe, and is enabled by default.
∆ Integrated Peripheral Setting.
∆ Internal setting options.
∆ USB Settings.
∆ AMD Overclocking setting.
∆ Boot Hard Disk Sort.
∆ Advanced CPU Settings.
∆ AMD PBO (Precision Boost Overdrive) is hidden in the advanced CPU settings.
∆ MSI's AMD PBO mode selection.
∆ AMD CBS.
∆ Memory parameter view.
∆ Processor overclocking settings.
∆ Overclocking setting related.
∆ Although the X670E ACE can manually exceed 8000 MT/s, the Memory Try It! is still stuck at DDR5 6600.
∆ BIOS Setup Storage Area.
∆ Fan speed curve setting.
MSI MEG X670E ACE Motherboard Performance Testing
∆ MEG X670E ACE motherboard lighting effect.
The MSI MEG X670E ACE motherboard is equipped with a 12-core, 24-thread AMD Ryzen 9 7900 processor and the motherboard BIOS has been updated to version 7D69v193 (Beta version), while the memory is a Kingston FURY Renegade DDR5 RGB 7200. MT/s 16GBx2 dual-channel memory kit. During the setup of the test platform, the memory was opened to the A-XMP profile, and AMD PBO was manually set to start, and the rest of the test was done using the motherboard's AUTO settings.
Testing Platform
Processor: AMD Ryzen 9 7900
Cooler: MSI MEG CORELIQUID S360
Motherboard: MSI MEG X670E ACE (BIOS version: 7D69v193[Beta version])
Memory: Kingston FURY Renegade DDR5 RGB 7200 MT/s 16GBx2
Graphics: MSI GeForce RTX 3060 Ti GAMING Z TRIO
Operating System: Windows 11 Professional 22H2
System Drive: Kingston A2000 NVMe PCIe SSD 500GB
Gaming Disk: CS2140 M.2 2280 NVMe Gen4x4 SSD 1TB
Power Supply: FSP Hydro PTM PRO ATX3.0 (PCIe5.0) 1200W
Chassis: CORSAIR 7000D AIRFLOW
Graphics driver: GeForce Game Ready 536.23
First of all, CPU-Z will check the hardware information of this test platform, the processor AMD Ryzen 9 7900 12C 24T, code name Raphael, using TSMC TSMC 5nm process, the motherboard using MEG X670 ACE supporting PCI-E 5.0 lanes, and the BIOS is updated to version 7D69v193 (Beta version), the memory using DDR5 RGB 7200 MT/s CL38 dual-channel capacity totaling 32 GB. The motherboard uses MEG X670 ACE supporting PCI-E 5.0 lanes, and the BIOS has been updated to 7D69v193 (Beta version). The memory uses DDR5 RGB 7200 MT/s CL38 with a total of 32 GB of dual-channel capacity, and the CPU-Z built-in test Version 17.01.64 was run, with the CPU scoring 740 points for single-threaded and 11738.1 points for multi-threaded.
∆ CPU-Z information at a glance and Version 17.01.64 built-in test score results.
CINEBENCH R20 and R23 are commonly used to evaluate the 3D rendering and graphics performance of the processor itself, and were developed by MAXON based on Cinema 4D.
In Release 20 the Ryzen 9 7900 scored 11081 pts multi-core and 744 pts single-core, while the new R23 version scored 28175 pts multi-core and 1880 pts single-core.
∆ CINEBENCH Release 20.
∆ CINEBENCH R23.
The AIDA64 memory and cache tests, this time using DDR5 7200 MT/s 16GB x2 CL38 dual-channel memory with XMP on, yielded read speeds of 79,879 MB/s, write speeds of 82,788 MB/s, copy speeds of 74,544 MB/s, and a latency of 76.3ns.
I have tested this memory on 13900K and MSI MPG Z790 CARBON WIFI platforms, but the results are a bit lower than 13900K platform.
∆ AIDA64 cache and memory test.
3DMark CPU Profile This test measures the performance of MAX, 16, 8, 4, 2 and 1 threads respectively, while the performance of 16 threads and above belongs to the 3D rendering or audio/video professional work, most of the mainstream DX12 games can refer to the score of 8 threads, while the scores of 4 and 2 threads are related to the old games developed with DX9. The 4 and 2 thread scores are related to older games developed with DX9.
The Ryzen 9 7900 scored 12758 points for maximum threads, while mainstream gamers need to be aware of the 8 and 4 threads, which scored 7767 and 4064 points respectively.
∆ 3DMARK CPU Profile.
The author also used 3DMark Fire Strike and 3DMark Time Spy, which are commonly used for gaming performance simulation tests, with NVIDIA RTX 3060 Ti graphics card to conduct the test. In Fire Strike, which simulates DX11 situational gaming simulation test at 1080p, the author obtained a physical score of 40825, while in Time Spy, which simulates DX12 situational gaming simulation test at 1440p, the author obtained a CPU score of 15577. In Time Spy, which simulates DX12 situational gaming at 1440p, it achieved a CPU score of 15577.
∆ 3DMark Fire Strike.
∆ 3DMark Time Spy.
The V-Ray 5 Benchmark has three different test scenarios, and the V-Ray program tests processor rendering performance, with the R9 7900 test platform scoring 21874 points.
∆ V-Ray 5 Benchmark.
CrossMark has a total of 25 items, including productivity, creative content work, system responsiveness and other work simulation load test, the following three scores have different scoring standards and use of the context, Productivity (Productivity) includes document editing, spreadsheets, web browsing, the second Creativity (Creativity) includes photo editing, photo organizing, video editing, and the last Responsiveness (Responsiveness) has to open the file, file response speed, multi-processing and other contexts. Productivity includes document editing, spreadsheets, and web browsing; Creativity includes photo editing, photo organizing, and video editing; and Responsiveness includes file opening, document response speed, and multiprocessing.
In this CrossMark test, it scored 2041 total points, 1871 productivity points, 2456 creativity points, and 1519 reaction points.
∆ CrossMark Everyday Use Scene Test Program.
Conclusion
With 22+2+1 Duet Rail Power System (DRPS), the MEG X670E ACE demonstrates the performance of MEG's flagship series in terms of expandability and power supply capacity. When used with an M.2 XPANDER-Z GEN5 DUAL PCI-Express expansion card, the MEG X670E ACE can obtain Up to six M.2 expansion slots, three of which are PCIe Gen5 x4 and three of which are PCIe Gen4 x4.
After updating to the AMI BIOS version with AGESA ComboPI 1.0.0.7c firmware, the memory is indeed more compatible. In this unboxing, the author used the Kingston FURY Renegade DDR5 RGB 7200 MT/s 16GBx2 memory with the A-XMP Profile 7200 and started up smoothly and steadily until now. The Profile 7200 has booted up smoothly and has been used stably until now.
With PCIe 5.0 Slot, Lightning Gen5 x4 M.2, USB 3.2 Gen 2×2 20Gbps with 60W PD fast charging on the front, you don't have to disable an expansion slot like Z790 to expand multiple M.2 SSDs with dual PCIe 5.0 bandwidth, MEG X670E ACE gives you the most ample expansion options and at least all the way to 2025! MEG X670E ACE gives you the most expansion options and at least all the way to 2025!
Yun
Drinks with less than full sugar are colored water. Crossing Turbid Creek, full sugar is not a crime!
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