GIGABYTE X870E AORUS XTREME X3D AI TOP Motherboard Unboxing Review｜Power, Cooling, Score and Temperature Measurement

The 24+2+2-phase AMD flagship GIGABYTE X870E AORUS XTREME X3D AI TOP motherboard is an E-ATX king that offers 5 M.2 slots, 4 DDR5 slots, two 10GbE wired LANs, and Wi-Fi 7 for AMD Ryzen 9000/8000/7000 series processors. It supports AMD Ryzen 9000 / 8000 / 7000 series processors, and features GIGABYTE X3D Turbo Mode 2.0 to further enhance system gaming and multitasking performance, and additional accessories such as CPU Thermal Matrix, M.2 Thermal Guard Xtreme, and DDR Wind Blade XTREME to enhance platform cooling performance.

GIGABYTE X870E AORUS XTREME X3D AI TOP Motherboard Specification.

Size: E-ATX 30.5 x 28.5 cm
Processor Support: AMD Ryzen 9000 / 8000 / 7000
Processor Pin: AM5 LGA1718
CPU supply phase: 24(110A)+2(110A)+2(60A) phases
Chipset: AMD X870E
Memory Expansion: 4x DDR5 DIMMs slots, 9000(O.C.) MT/s, up to 256 GB (single slot supports 64 GB capacity)
Memory Certification: AMD EXPO (Extended Profiles for Overclocking), Intel XMP 3.0 (Extreme Memory Profile)
Internal Display Output Slot: HDMI 2.1 (4K 60 Hz), 2x USB4 Type-C (4K 240 Hz), Front Internal USB Type-C (1920×1080 30 Hz)
Graphics expansion slots: 2x PCIe 5.0 x16 (supports single card x16, dual card x8/x8 shared bandwidth slice mode), PCIe 4.0 x4 (third slot has x16 length but only PCIe 4.0 x4 bandwidth)
Storage expansion slots: 2x SATA 6Gb/s, M2A_CPU 2580/2280 PCIe Gen5 x4/x2, M2B_CPU 22110/2280 PCIe Gen5 x4/x2, M2C_SB 22110/2280 PCIe Gen4 x4/x2, M2D_SB 22110/2280 PCIe Gen4 x4/x2, M2E_SB 2280 PCIe Gen4 x2
Wired Network: 2x Realtek 10 Gbps
Wireless transmission: MediaTek Wi-Fi 7 MT7927, RZ738, Bluetooth 5.4
Audio chip: 1x ESS ES9280AC DAC+ 2x ESS ES9080
USB Ports (Front Expansion): 1x USB 20Gbps Type-C, 1x USB 10Gbps Type-C, 1x USB 2.0 Type-C (Supports Internal Display Output), 2x USB 5Gbps (Supports four USB 5Gbps Type-A ports on front)
USB Ports (Rear I/O): 2x USB 4 Type-C (40Gbps), 1x USB 20Gbps Type-C, 1x USB 10Gbps Type-C, 8x USB 10Gbps Type-A (red)
RGB Power Slots: 4x ARGB Gen2 5V 3-Pin, 1x RGB 12V 4-Pin
Fan power supply slots: 1x 4-Pin CPU Fan, 1x 4-Pin CPU OPT, 4x 4-Pin SYS FAN, 3x 4-Pin SYS FAN/PUMP

GIGABYTE X870E AORUS XTREME X3D AI TOP Accessories Unboxing｜CPU Thermal Matrix, M.2 Thermal Guard Xtreme Thermal Analysis

GIGABYTE's new AMD AM5 flagship motherboard, the X870E AORUS XTREME X3D AI TOP, is designed to X3D Turbo Mode 2.0 FeaturesThe X870E AORUS XTREME AI TOP motherboard has been updated to replace the original flagship “X870E AORUS XTREME AI TOP” motherboard. The naming difference between the two new and old flagships is whether or not they have the X3D or not, and with X3D is the newest flagship which is the one that the author is going to open the box for today, but the launching time of the two models is really close to each other, and it is a bit embarrassing for consumers who bought the original X870E AORUS XTREME AI TOP. The X870E AORUS XTREME AI TOP is a bit awkward for consumers, but the price difference between the two models is now $9,000, which is quite a price difference.

In the packaging of this flagship motherboard boxed protection is very adequate, the entire volume of the outer box "very, very large", motorcycle front pedal area is absolutely not put, strongly recommended the use of online shopping home delivery to the home is the best.

The △ X870E AORUS XTREME X3D AI TOP boxed set is very, very large.

△ Basic features and specifications of the motherboard.

When you open the box, you can see the big GIGABYTE AORUS.

△ Xtreme Ventures.

 

The accessory box at the bottom is also very rich in contents, and the accessories are stored in two layers, so you need to check a little bit when you just bought it.

Accessories include: Thunderbolt AORUS 3 in 1 Bottle Opener, Thunderbolt AORUS MiiR Cooling and Warming Mug, 2 SATA cables, Wi-Fi 7 antenna, 1 integrated programmable RGB Gen2 LED Strip / RGB LED Strip Extension Cable (LED_C slot adapts 4x ARGB Gen2 5V 3-Pin, 1x RGB 12V 4-Pin), Front Control Panel Extension Cable (F_PANEL Front Pushbutton Adapter Cable), 2 Fan Socket Extension Cables (one to three PWM 4-Pin), 1 Integrated System Fan/Water Cooler and USB 2.0/1.1 Socket Extension Cable (to one PWM 4-Pin and two USB slots), 2 Thermal Cables, G Connector, 2 Devil's Felt Harnesses ESSential USB DAC, DDR Wind Blade Xtreme, CPU Thermal Matrix, M.2 Thermal Guard Xtreme.

△ The first layer of the accessory box.

△ The rest of the accessories at a glance, there is a GIGABYTE 39th anniversary sticker in the middle, 40th anniversary feel will also come out related products?

△ The ESSential USB DAC connector uses the USB C interface.

The △ output is 3.5 mm.

 

The DDR Wind Blade Xtreme is a shrouded memory fan unit, with airflow moving from the bottom to the top (in the case of a typical motherboard installation), and is much more efficient than the DDR Wind Blade Xtreme. X870E AORUS MASTER The included DDR Wind Blade is a bit more complete, the DDR Wind Blade Xtreme doesn't require an additional fan to be connected to the power supply, it can be powered through the metal contacts on the motherboard, and the fan can be recognized in the BIOS and software, which means that it can be controlled by the fan speed curve.

△ DDR Wind Blade Xtreme.

△ A small fan is built-in to exhaust air to the top of the case, and there is a grille at the bottom of the fan cover for air intake.

△ Bottom fan power supply contact.

 

However, because of the fan cover concept, the right side of the motherboard is closed to the airflow inside the chassis will be a block, if you want to install an air-cooled tower radiator is not so recommended, and the author will strongly recommend the installation of the G.SKILL Flare X5 Flame Gun DDR5 6000 CL28 192GB (4x48GB) Users of this four-strip memory package can use it together to enhance memory cooling airflow for better stability.

△ Contacts correspond to the location of the motherboard, to remove the motherboard magnetism cover, you can see the motherboard end of the contacts.

△ Installation Demonstration.

△ Height 47.3 mm Origin code vortex DDR5 48 GB (24 GBx2) MemoryInstallation demonstration with plenty of room for installation inside.

 

X870E AORUS XTREME X3D AI TOP In addition to the thin M.2 heat sink armor on board, if you want to use Gen5 SSDs with higher heat generation, you can replace it with M.2 Thermal Guard Xtreme, which provides active cooling for Gen5 SSDs by using fully riveted heatpipes with direct contact and a small fan. The M.2 Thermal Guard Xtreme is a fully riveted heat pipe with a small fan to provide active cooling for Gen5 SSDs.

The active fan does not require an additional fan to be connected to the power supply, but can be powered through the metal contacts on the motherboard, and can also be recognized in the BIOS and software.

△ M.2 Thermal Guard Xtreme provided as an additional accessory.

△ Use heat pipes, cooling fins, and active fans to dissipate heat, and exhaust the fan toward the processor.

△ Use a thermal pad to conduct SSD waste heat.

△ M.2 Installation Block Demonstration.

 

The GIGABYTE X870E AORUS XTREME X3D AI TOP comes with a special accessory, the CPU Thermal Matrix, which is officially labeled as lowering the temperature of the VRM by up to 8.5 °C and the DDR by up to 6 °C. It looks very similar to the "Thermal Grizzly Contact Sealing Frame / AM5 CPU cover".

However, the GIGABYTE CPU Thermal Matrix has a wider coverage, and the contact surface with the motherboard PCB even uses thermal pads to assist the PCB to passively dissipate the heat, in terms of the installation form, I can understand that there is a possibility for the VRM temperature to be increased, but I am not too sure if the DDR temperature will really be increased, because the CPU Thermal Matrix actually has the following features The CPU Thermal Matrix actually covers the layout area that connects the CPU to the DDR5 socket, can adding passive cooling to this area in the middle really enhance the cooling effect of the DDR5 memory itself? I guess only RD, a more professional testing equipment lab, can answer this question.

△ GIGABYTE CPU Thermal Matrix.

△There is a thermal pad on the back of the case to help dissipate heat when it comes in contact with the motherboard PCB.

△ CPU Thermal Matrix practical installation demonstration.

 

In addition to assisting with PCB cooling, the CPU Thermal Matrix is more like a customized AM5 CPU cover for the X870E AORUS XTREME X3D AI TOP for most users, more so to prevent the thermal paste from getting into the cracks of the AM5 IHS.

However, the CPU Thermal Matrix does not require the removal of the silver AM5 SAM (Socket Actuation Mechanism_the one that holds the processor body in place), but it does require the removal of the black AM5 cooling grommet (the one that holds the processor heatsink in place), and the official labeling says that when installing the CPU Thermal Matrix "The official label also states that when installing the CPU Thermal Matrix, "Heat sinks that need to be fastened to AMD's factory grommets are not applicable.

To use the CPU Thermal Matrix, you need to replace it with a copper post or sleeve mounted heatsink, such as the one previously unboxed. AORUS WATERFORCE II 360 ICE All-in-One WatercoolerHowever, not all replacement heat sinks are compatible, and the one I have in my hand is not. LIAN LI GA II LITE 360 RGB All-in-One WatercoolerIt is a replacement for the clips, but not a replacement for the socket or brass post solution, which would be incompatible with the size mechanism, so the safest thing to do is to pair it with GIGABYTE's own water cooling with the device.

△ Official CPU Thermal Matrix installation instructions.

△ Remove the motherboard's original heatsink fasteners before installation.

△ CPU Thermal Matrix is fixed by thermal pads, and the motherboard's original heatsink grommets are not compatible after installation.

Not all cooler replacements are compatible with GIGABYTE's water coolers, so the best bet is to use GIGABYTE's own water coolers.

 

GIGABYTE X870E AORUS XTREME X3D AI TOP Motherboard Unboxing｜Design and Specifications at a Glance

From the outside, the X870E AORUS XTREME X3D AI TOP looks more elegant and aesthetically pleasing than the X870E AORUS XTREME AI TOP's gaming-rendering style, with better masking on the motherboard.

The GIGABYTE X870E AORUS XTREME X3D AI TOP motherboard utilizes an E-ATX 30.5 x 28.5 cm form factor, 24+2+2 power supply design, while the 24-phase SPS 110A VCORE Phases are powered by 12+12 phases, and the PCB is an 8-Layer, 8-Layer specification.

△ E-ATX size GIGABYTE X870E AORUS XTREME X3D AI TOP.

△ The back has a reinforced back plate.

△ Motherboard channel configuration diagram.

 

The VRM heat sink on the motherboard utilizes a zigzag heat sink to dissipate power underneath, and maintains system stability through 8+6 mm dual heat pipes with 12 W/mK high-efficiency heat sink pads in direct contact with the MOSFETs.

The X870E still uses the AM5 LGA 1718 socket to support AMD Ryzen 9000 / 8000 / 7000 processors, and because it retains the same heatsink grommets and hole spacing as AM4, gamers can install it directly along the AM4 heatsink grommet set.

△ VRM Thermal Armor Advanced.

△ VRM heat conduit, the other one is hidden at the bottom where it cannot be seen.

 

Let's take a look at the expansion and power supply slots on the motherboard. On the upper left side of the motherboard, there is an 8+8-Pin ATX_12V power supply slot for the processor.

In the upper right corner of the motherboard, there are two temperature sensor slots, one CPU_OPT, one CPU_FAN and water cooling power supply slots, where you can install the water cooling head PUMP power supply and water cooling exhaust fan cable when installing the integrated water cooling.

△ There is a magnetic cover on top of the motherboard to cover the cables and slots.

△The cable can be temporarily removed when it is inserted.

The motherboard uses dual 8-Pin processor power supply slots.

△ Two temperature-sensitive sideline slots, one CPU_OPT, one CPU_FAN.

 

The quad-slot DDR5 DIMM Dual Snap-In Memory Slots are 2DPC (2DIMM Per channel) configured to support non-ECC Un-buffered DIMMs, with a maximum expansion capacity of 256 GB across the four slots, or 64 GB per slot, and support for AMD EXPO (Extended Profiles for Overclocking) and Intel XMP 3.0 (Extreme Memory Profile) memory one-click overclocking profiles. It also supports AMD EXPO (Extended Profiles for Overclocking) and Intel XMP 3.0 (Extreme Memory Profile) memory one-click overclocking profiles.

The memory overclocking QVL memory support list features dual-channel memory modules that can pass the compatibility stress test at a maximum frequency of 9000 MT/s when used with Ryzen 8000 series processors, reminding you once again to choose your memory model based on the motherboard memory QVL (Qualified Vendor List) compatibility report. Vendor List (QVL) compatibility report of the motherboard to select the best memory model.

For the 2 DIMMs dual-channel memory kits that are often purchased in today's orders, it is recommended to prioritize the installation in slots A2 and B2 (the second and fourth slots counting from the left). By installing the two memories in these two slots, the memory will be able to operate more easily and at a higher frequency.

△ 4x Un-buffered DIMMs DDR5 memory slots, UDIMM-compatible, supports up to 256 GB of capacity expansion, and up to 9000 MT/s (O.C.) with QVL on both modules.

 

12V (auxiliary power supply slot for 65W PD 3.0/QC 4+ fast charging for the adjacent front USB 20Gbps Type-C), one front USB 20Gbps Type-C slot, two SATA 6Gb/s, LED_C (4x ARGB Gen2 5V 3-Pin, 1x RGB 12V 4-Pin via accessory specific adapter cable), LED_C (4x ARGB Gen2 5V 3-Pin, 1x RGB 12V 4-Pin via accessory specific adapter cable), and LED_C (4x ARGB Gen2 5V 4-Pin, 1x RGB 12V 4-Pin). 12V 4-Pin), F_USB_FAN (one PWM 4-Pin, two USB 2.0 expansion slots via accessory-specific adapter cables), two USB 5Gbps slots (supports four front USB 5Gbps Type-A ports), F_PANEL (front control panel receptacle_required with accessory-specific adapter cables), and more.

The debugging light code display allows users to quickly check what parts of the motherboard are causing problems during the self-testing process, and users can refer to the motherboard manual for debugging actions.

The USBDP USB 2.0 Type-C slot is the interface for the processor's built-in graphics card output. This slot supports DP technology and can be used to connect to a small screen inside the chassis, users can use it to connect to an additional small screen inside the chassis, the slot can support up to 1920×1080@30 Hz display specifications. In order to use this display output function, your CPU must have a built-in graphics card, so if there is an F in the processor model (e.g. 7500F), you can't use this display output function.

△ DeBug lamp code display DeBug lamp, CLR_CMOS Clear CMOS data button, POWER button, RESET system reboot button.

△ The debugging lamp code display quickly identifies where the problem is.

△ One PWM 4-Pin FAN/PUMP and water-cooling power supply slot, 3_FANS_1 System Fan Extension Cord Receptacle (three PWM 4-Pin via accessory-specific adapter cable), 3_FANS_2 System Fan/Water-cooling Pump Extension Cord Receptacle (three PWM 4-Pin via accessory-specific adapter cable), USBDP USB 2.0 Type-C (supports FHD 30 Hz internal display output), motherboard 24-Pin power supply slot, F20G_12V (auxiliary slot to provide 65W PD 3.0/QC 4+ fast charging for the adjacent front USB 20Gbps Type-C), and a front USB 20Gbps Type-C slot.

△ One front USB 10Gbps Type-C slot.

△ Two SATA 6Gb/s, LED_C (4x ARGB Gen2 5V 3-Pin, 1x RGB 12V 4-Pin via accessory-specific adapter cable), F_USB_FAN (one PWM 4-Pin via accessory-specific adapter cable, two USB 2.0 expansion slots), two USB 5Gbps slots (supports four front USB 5Gbps Type-A ports), F_PANEL (front control panel socket - requires accessory-specific adapter cable). USB 5Gbps Type-A ports), F_PANEL (front control panel socket_required with accessory-specific adapter cable).

 

The motherboard PCIE slots provide a total of three x16-length device expansion slots. The two metal-reinforced x16 slots on top are for direct processor connections, and the first PCIEX16 slot can provide full PCIE 5.0 x16 bandwidth when installing a single device such as a discrete graphics card, but if a dual graphics card is installed using both the first and second PCIEX8 slots, the bandwidth will be split evenly between x8 and x8 channels, so it is important to install the PCIEX16 slot when installing only one graphics card because the second PCIEX8 slot only provides up to a maximum of x8 bandwidth. However, if dual graphics cards are installed using both the first PCIEX16 slot and the second PCIEX8 slot, the channel bandwidth will be split equally between x8 and x8. Therefore, it is important to install the PCIEX16 slot when installing only one graphics card as the second PCIEX8 slot only provides PCIE 5.0 x8 bandwidth at the maximum.

The bottom PCIEX4 slot takes the X870E PCH chipset channel and provides PCIe 4.0 x4 bandwidth, but it shares the bandwidth channel with the M2D_SB expansion slot, so PCIEX4 cannot be used when M.2 hard disks are installed in the M2D_SB slot.

△ If only one graphics card is installed, it can be used with the magnetic cover.

△ After removing the cover, you can see three expansion slots, from top to bottom PCIE 5.0_PCIEX16 (CPU), PCIE 5.0_PCIEX8 (CPU), PCIE 4.0 x4_PCIEX4 (PCH).

△ Display card DIY friendly fixed structure.

 

By default, each M.2 expansion slot on this motherboard is equipped with passive heat sinks and an exclusive patented M.2 EZ-Flex design M.2 SSD high-performance thermal flex base plate, with top and bottom thermal pads for M.2 SSDs with double-sided particles in each slot to provide complete thermal planning.

GIGABYTE's top-of-the-line M2A_CPU PCIE Gen5 x4 M.2 SSD expansion slot comes with a thin passive heatsink, but it can also be swapped out for the accessory M.2 Thermal Guard Xtreme, which further enhances SSD cooling by using a processor direct channel to support M.2 SSDs up to 2580/2280 in size. installation.

The larger M.2 Thermal Guard Ext. heatsink covers the lower four M.2 SSDs for cooling and is held in place by the M.2 EZ-Latch Click, and all M.2 SSD mounting locations have an M.2 EZ-Latch Plus to hold the SSD body in place, with the second and third slots M2C_SB, M2D_SB, and M2D_SB counting down using the chipset channel and supporting 22110/2280 PCIE Gen4 x4 SSD expansion. The second and third slots M2C_SB, M2D_SB, and M2D_SB all utilize the chipset channel and support 22110/2280 PCIE Gen4 x4 SSD expansion.

The fourth M2B_CPU expansion slot is the processor direct connect channel, and it provides PCIe Gen5 x4 bandwidth to support 22110/2280 size M.2 SSD expansion. Note that this slot shares the bandwidth with the USB 4 interface at the back, so by default, this M2B_CPU slot only has PCIE Gen5 x2 bandwidth, and you need to go to the BIOS to adjust the bandwidth setting to turn off USB 4 Type-C in order to have the full PCIE Gen5 x4 bandwidth. If you want to get the full bandwidth, you have to adjust the bandwidth setting in the BIOS to disable the USB 4 Type-C to get the full PCIE Gen5 x4 bandwidth.

The M2E_SB in the lower right corner uses the PCH chipset channel and supports 2280 PCIE Gen4 x2 SSD expansion.

△ All M.2 SSD expansion locations have a complete dual-sided cooling plan.

The △ M.2 SSD is held in place by the M.2 EZ-Latch Plus, and there are five M.2 SSD expansion mounting positions on board, from top to bottom: M2A_CPU Gen5, M2C_SB Gen4, M2D_SB Gen4, M2B_CPU Gen5, and M2E_SB Gen4.

 

I/O on the rear of the motherboard provides a Q-Flash Plus button, a unique overclocking ignition button, an HDMI 2.1 internal display output (supports up to 4096×2160 60 Hz resolution), audio output, microphone input, eight USB 10Gbps Type-A (red), two USB 4 Type-C 40Gbps, one USB 20Gbps Type-C, one USB 10Gbps Type-C, optical S/PDIF digital audio output, two RJ-45 10 Gbps LAN wired network ports, Wi-Fi 7-antenna port WIFI EZ-Plug.

Exclusive overclocking ignition button can provide users in the installation of split water-cooling system, after pressing this button, and then press the boot button can be pre-powered to check the water-cooled water circuit is OK, even if the processor is not yet installed can also be used, if the daily use of the boot button found that it is necessary to press the boot button twice before the boot, you can check whether the button is not accidentally go to open up the key to the key to be pressed off the boot button presses to a time. Pressing this button off will only perform the boot-up procedure with one press of the boot-up button.

There are two USB 4 Type-C 40Gbps ports on the rear of the motherboard, and the processor's built-in graphics output supports DisplayPort version 1.4, which allows users to have an additional display output slot available through the internal display, with up to 3840×2160 240 Hz resolution for video output.

△ Rear I/O at a glance.

 

X870E AORUS XTREME X3D AI TOP RGB Lighting Show｜LCD Screen and Lighting Effect Photos

Then the actual power on and off to show the motherboard on-board lighting effect for your reference.

GIGABYTE X870E AORUS XTREME X3D AI TOP motherboard lighting effect.

The 5-inch LCD screen is preset to play animations and related monitoring information, and during the self-test, it shows which process the self-test has reached.

Close-up of M.2 Thermal Guard Xtreme lighting effect.

Close-up of the PCH block heatsink.

 

GIGABYTE X870E AORUS XTREME X3D AI TOP Motherboard Performance Testing

The motherboard performance of GIGABYTE X870E AORUS XTREME X3D AI TOP is tested with 16 cores and 32 threads. AMD Ryzen 9 9950X3D processor, and update the motherboard BIOS to version F3, and use the Origin code vortex DDR5 48 GB (24 GBx2) Dual-channel memory kit to build barebones platforms and open profile profiles for the memory.

Extra On GIGABYTE High Bandwidth and Low Latency FeaturesX3D Turbo Mode 2_Maximum Performance, AMD PBO manual setting to Enabled, 90 Level 1, and traditional test software performance enhancement for testing.

Testing Platform

Processor:AMD Ryzen 9 9950X3D (PBO activated)
Cooler: LIAN LI GA II Trinity SL-INF 360 (full speed)
Water-cooled fans: 3x LIAN LI P28 (full speed)
Thermal paste: Cooler Master MASTERGEL MAKER 40g (thermal conductivity 11W/mK)
Motherboard: GIGABYTE X870E AORUS XTREME X3D AI TOP (BIOS Version: F7a)
Memory:Origin code vortex DDR5 48 GB (24 GBx2) 8000 MT/s CL36-47-47-108 1.45V
Graphics: NVIDIA GeForce RTX 4060 Ti Founders Edition 8GB
Operating System: Windows 11 Professional 24H2
Power supply:FSP Hydro PTM PRO ATX3.0 (PCIe5.0) 1200W
Case: STREACOM BC1 Benchtable V2

 

firstly CPU-Z View this testbed hardware information.AMD Ryzen 9 9950X3D The processor has 16 cores and 32 threads, the series name is Granite Ridge using TSMC 4nm FinFET process, the motherboard is GIGABYTE X870E AORUS XTREME X3D AI TOP supporting PCI-E 5.0 lanes, and the BIOS is F7a version.

We also ran the CPU-Z internal tests for your reference.

CPU-Z platform information at a glance.

△ CPU-Z internal test score results.

 

AIDA64 Cache & Memory Benchmark It is mainly used to test the performance of processor caches and RAM. The read/write/copy bandwidth performance score represents the rate of transfer between CPU and memory, which means the efficiency of data throughput (the higher the score, the better), and the time delay score of accessing data indicates the responsiveness of the memory system.

Tested on this motherboard with Memory Profile turned on, read speeds were 91.1 GB/s, write speeds were 99.1 GB/s, copy speeds were 81 GB/s, and latency was 67 ns.

△ AIDA64 cache and memory test.

 

by Maxon Cinebench An industry-standard benchmarking software, Cinebench 2026 tests GPU and CPU performance using Maxon's powerful Redshift rendering engine.

The new version of Cinebench 2026 adds a test for evaluating the performance of SMT-enabled CPU cores, which means that it is now possible to test: GPU, processor full-core, processor single-core, and processor single-thread performance.

Based on the latest Cinema 4D 2026 and Redshift code, and using the updated Clang V19 compiler, the benchmarking accuracy of contemporary and next-generation processors has been improved to test whether the equipment is stable under high loads, whether the thermal solutions of the desktop or laptop are sufficient to cope with the demands of long-term operation in order to maximize the potential of the CPU, and whether the machine is capable of handling demanding 3D tasks. and whether the machine is capable of handling demanding 3D tasks.

△ Cinebench 2026.

 

PCMark 10 It also simulates test scenarios to determine the overall performance of the computer. The common basic functions include application launching, web browsing, and video conferencing tests, while productivity simulates document and spreadsheet writing, and the last item, video content creation, includes professional tests such as photo editing, video editing, and rendering.

△ PCMark 10 test.

 

3DMark Score Test｜X870E AORUS XTREME X3D AI TOP GAMING PERFORMANCE

Next up, the 3DMark series, one of the most benchmarks for gaming scores, was used to compare the theoretical results of the same graphics platform with different processors through a series of tests with different picture quality and different GPU APIs.

3DMark CPU Profile This test will test the performance of MAX, 16, 8, 4, 2, 1 threads respectively, while the performance of 16 threads and above is more for 3D rendering or audio/video professional work, and most of the mainstream DirectX 12 game performance can refer to the score of 8 threads, while the score of 4 and 2 threads are related to the old games developed with DirectX 9.

△ 3DMark CPU Profile.

 

In addition, the author has also used the commonly used game performance simulation test 3DMark Fire Strike、3DMark Time SpyThe two programs are Fire Strike, which represents the 1080p quality DirectX11 GPU API situational game simulation test, and Time Spy, which represents the 1440p quality DirectX 12 GPU API situational game simulation test.

△ 3DMark Fire Strike.

△ 3DMark Time Spy.

 

M.2 Thermal Guard Xtreme Temperature Measurement｜Gen5 SSD Thermal Performance Testing

將Micron Micron Crucial T710 1TB PCIe Gen5 NVMe 2280 M.2 SSD Solid State DriveIn addition, the M.2 Thermal Guard Xtreme was used for testing with the included M.2 Thermal Guard Xtreme without the additional fan blowing directly on the motherboard for cooling.

The test software still uses CrystalDiskMark Settings:NVMe SSD / Profile:Default, but manually adjust the number of times to 9; test file size setting to 64 GiB, some foreign media will set their own scripts to stress test, but the author personally think that Taiwanese gamers are more commonly used. CrystalDiskMark The M.2 SSD software is used to test your own M.2 SSDs, so it would be better to continue using the same software to reproduce the test on your own, in the same way as in the previous M.2 SSDs.Pressurize with All-in-One Water Cooling! What kind of cooler do I need for M.2 PCIE Gen5 SSDs?The article is the same, so you can check it out.

Temperature logging is done by using HWinfo64 software to record the maximum temperature of the hard disk, and manually adjusting the polling cycle in the HWinfo64 software to record the temperature of the M.2 SSD itself in a more real-time manner by adjusting the following settings. Why don't we use CrystalDiskInfo software to record the temperature? Because when there are multiple temperature sensors on an M.2 SSD, CrystalDiskInfo only displays the first sensor in order; sometimes the drive manufacturer will adjust the sensor temperature order so that the master chip is not always first, resulting in viewing temperatures from other locations. Furthermore, CrystalDiskInfo is very slow in updating the temperature sensors, and the difference between the displayed temperature and the actual temperature can be as much as 5~10 °C due to the lack of real-time updating of the temperature sensors.

• Global:20 ms
• Disk SMART every 1 cycle
• Embedded Controller every 1 cycle

△ CrystalDiskMark Settings: NVMe SSD / Profile: Default, but manually adjusted the number of tests to 9; the test file size setting was changed to 64 GiB, and the maximum temperature is 48 °C.

 

X870E AORUS XTREME X3D AI TOP VRM Temperature Test｜Power Supply Cooling Performance Analysis

After 30 minutes of Cinebench 2026 multi-core testing, the GIGABYTE X870E AORUS XTREME X3D AI TOP motherboard on barebones testing platform, without additional fan blowing directly on the indoor temperature of 28 °C, the VRM MOS temperature peaked at 58 °C while the PCH temperature peaked at 55 °C. The VRM MOS temperature is the highest at 28 °C, while the PCH temperature peaked at 55 °C. The VRM MOS temperature is the highest at 28 °C.

During the VRM cooling test, no extra fan was used to blow directly on the motherboard.

Temperature information after a half-hour Cinebench 2026 multi-core test.

 

During the half-hour Cinebench 2026 multi-core test, a FLIR ONE PRO thermal imaging camera was used to observe the surface temperature of the VRM's heat sinks for your reference.

△ The surface temperature of the VRM thermal armor during the test was 49~52.5 °C, next to the 56 °C temperature of the PCB and capacitors.

 

X870E AORUS XTREME X3D AI TOP Review Summary｜Is it worth getting? Pros and Cons

As GIGABYTE's flagship in the AMD AM5 consumer motherboard product line, the X870E AORUS XTREME X3D AI TOP, with its outlook style, expandability, DIY-friendly design, hardware specifications, and accessory offerings, is far more complete than any other motherboard model that I've unboxed in the past, and what I've found to be unfortunate about the past is not present on this motherboard. It fully demonstrates the logic of "if you want the best planning, you have to go to the flagship", the only problem is my wallet.

 

The accessories include CPU Thermal Matrix, M.2 Thermal Guard Xtreme, DDR Wind Blade XTREME, etc., which further enhance the cooling performance of different hardware blocks and bring a more stable system experience, and this time, we have tested the M.2 Thermal Guard Xtreme with Gen5 SSD. In this test, M.2 Thermal Guard Xtreme was paired with a Gen5 SSD for temperature monitoring, and the maximum temperature was only 48°C during the higher load test, which is quite good, and it should be even lower in daily use.

 

Expansion part of the five on-board native M.2 expansion slots, four slots DDR5 dual snap memory expansion slots, three PCIE X16 length device expansion slots, dual 10GbE LAN wired network holes & Wi-Fi 7 wireless network and other specifications, the current price of this board in Taiwan is about $ 34,990 or so, the price is really not to be able to say that you can buy, but on the flagship is really not so! I suggest that those who can afford it send me another board to play with.

 

The only thing you need to pay attention to is the CPU Thermal Matrix accessory, if you want to use it, the CPU Thermal Matrix has the requirement of institutional compatibility for the cooler mounting grommet set, so the author suggests that if you want to use it with the CPU Thermal Matrix, you'd better choose GIGABYTE's own water cooler as the safest choice, such as the one that has been out of the box previously. AORUS WATERFORCE II 360 ICE All-in-One WatercoolerThe CPU Thermal Matrix is not required to be used with the CPU, but if you have other coolers that you want to use, you can decide whether or not to use it with the CPU Thermal Matrix.